主要学术成果(论文、专利、专著、译著等) |
1. 主要期刊论文 (1) Yanwei Dai, Min Zhang, Fei Qin*, Pei Chen, Tong An. Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading. Engineering Fracture Mechanics, 2019(209): 274-300. (SCI) (2) Lixiang Zhang , Pei Chen, Tong An, Yanwei Dai, Fei Qin*. Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process. Current Applied Physics, 2019, 19(5): 570-581.(SCI) (3) Jinglong, Sun, Pei Chen, Fei Qin*, et al. Modelling and experimental study of roughness in silicon wafer self-rotating grinding. Precision Engineering, 2018, 51: 625-637. (SCI) (4) Si Chen, Tong An, Fei Qin*, Pei Chen. Microstructure Evolution and Protrusion of Electroplated Cu-Filled Through-Silicon Vias Subjected to Thermal Cyclic Loading. Journal of Electronic Materials,2017,46(10): 5916-5932. (SCI) (5) Wei Wu, Fei Qin, Tong An, Pei Chen. A Study of Creep Behavior of TSV-Cu Based on Nanoindentation Creep Test. Journal of Mechanics, 2016, 5:1-8. (SCI) (6) Si Chen, Fei Qin, Tong An, Pei Chen, Bin Xie, Xunqing Shi. Protrusion of electroplated copper filled in through silicon vias during annealing process. Microelectronics Reliability,2016, 63: 183-193. (SCI) (7) Jinglong Sun, Fei Qin, Pei Chen, Tong AN. A predictive model of grinding force in silicon wafer self-rotating grinding. International Journal of Machine Tools & Manufacture, 2016, 109: 74-86. (SCI) (8) Tong An, Fei Qin. Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints. Journal of Electronic Packaging, 2016, 138: 011002(10 pages). (SCI) (9) 陈思, 秦飞, 安彤, 王瑞铭, 赵静毅. 退火工艺对硅通孔填充Cu微结构演化与胀出行为的影响. 金属学报,2016, 52(2): 202-208. (SCI) (10) Wei Wu, Fei Qin, Tong An, Pei Chen. Experimental and Numerical Investigation of Mechanical Properties of Electroplating Copper Filled in Through Silicon Vias. IEEE TRANSACTIONS ON COMPONENTS, Packaging and Manufacturing Technology, 2016, 6(1): 23-30. (SCI) (11) 秦飞, 项敏, 武伟. 纳米压痕法确定TSV-Cu的应力-应变关系. 金属学报,2014, 50(6): 722-726. (SCI) (12) Tong An, Fei Qin. Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates. Microelectronics Reliability, 2014, 54: 932-938. (SCI) (13) Tong An, Fei Qin, Guofeng Xia. Analytical Solutions and a Numerical Approach for Diffusion-Induced Stresses in Intermetallic Compound Layers of Solder Joints. ASME Journal of Electronic Packaging, 2014, 136: 011001(8 pages). (SCI) (14) Guofeng Xia, Fei Qin, Cha Gao, Tong An, Wenhui Zhu. Reliability Design of Multirow Quad Flat Nonlead Packages Based on Numerical Design of Experiment Method. ASME Journal of Electronic Packaging, 2013, 135: 041007(6 pages) (SCI) (15) Tong An, Fei Qin. Intergranular cracking simulation of the intermetallic compound layer in solder joints. Computational Materials Science, 2013, 79: 1-14. (SCI) (16) Tong An, Fei Qin. Cracking of the Intermetallic Compound Layer in Solder Joints Under Drop Impact Loading. Journal of Electronic Packaging, 2011, 133: 031004(7pp). (SCI) (17) Qin Fei, Zhang Yang, Liu Yanan. Perturbed magnetic field of an infinite plate with a centered crack. Acta Mechanic Sinica, 2011, 27(2): 259-265. (SCI) (18) Tong An, Fei Qin, Jiangang Li. Mechanical behavior of solder joints under dynamic four-point impact bending. Microelectronics Reliability, 2011, 51: 1011–1019. (SCI) 2. 授权专利73项,美国专利2项,PCT3项。 3. 主要专著、译著 (1) 秦飞 编著. 材料力学. 北京: 科学出版社,2012年6月第1版. 书号:ISBN9787030338044. (国家精品课程主干教材,国家十二五普通高等教育规划教材,2013年北京市精品教材)。(61万字) (2) 秦飞,吴斌 编著.弹性与塑性理论基础.北京:科学出版社,2011年8月第1版. 书号:ISBN9787030322036。(40万字) (3) 秦飞,安彤,朱文辉,曹立强 译.可靠性物理与工程.北京:科学出版社,2013年10月第1版. 书号:ISBN9787030388247。(32万字) (4) 秦飞,曹立强 译.三维电子封装的硅通孔技术.北京:化学工业出版社,2014年7月第1版. 书号:ISBN9787122198976。(53万字) (5) 秦飞,别晓锐,安彤 译. 先进倒装芯片封装技术. 北京:化学工业出版社,2017年2月第1版. 书号:ISBN9787122276834。(63万字) |